How can I tell the difference between a hot air rework and an IR reflow?

In this post I will try to show and display the added stress that using a hot air system of any kind can damage the system motherboard. Now, in the hands of a skilled technician hot air systems can work great on non-powered chipsets, ie. chipsets with capacitors on top of them. Now I get questions all the time asking me such great questions as:

1. Why do I need to have a reflow performed by an IR system when I can do it with…. now we fill in the blank with such great industrial items as hair dryers, shrink wrap gun, heat gun, hot air station, flaming alcohol?

2. Why reflow it since it will fail again?

In the picture overhead, you see some of the damage that hot air systems will do to your chipset. As explained in the video below, the capacitors are visible to have been removed by force with the hot air system.